About us

ICEPT 2026 is one of the four major brand conferences in the field of international electronic packaging. The event provides an academic communication platform for global experts, scholars, and researchers to discuss new progress and ideas in electronic packaging and manufacturing technology. Participants will engage through special lectures, invited talks, theme forums, technical sessions, exhibitions, and poster presentations.

Important Dates

Fri, Mar 20, 2026

Deadline for Submission of Abstract

Mon, Apr 20, 2026

Notification of Abstract Acceptance

Wed, May 20, 2026

Deadline for Submission of Full Paper

Tue, Jun 30, 2026

Notification of Full Paper Acceptance

Paper Submission

Research Paper Submission Tracks

Advanced Manufacturing

Emerging Technologies

Advanced Packaging

Packaging Materials & Processes

Packaging Design & Modeling

Interconnection Technologies

Quality & Reliability

Power Electronics & Energy Electronics

Optoelectronics and New Display

RF Electronic Packaging

AI-Enabled Packaging Technologies

Call for Papers Description

All papers must be original and not simultaneously submitted to another journal or conference. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.