About us

ICEPT 2026 is one of the four major brand conferences in the field of international electronic packaging. The event provides an academic communication platform for global experts, scholars, and researchers to discuss new progress and ideas in electronic packaging and manufacturing technology. Participants will engage through special lectures, invited talks, theme forums, technical sessions, exhibitions, and poster presentations.

Important Dates

Fri, Mar 20, 2026
Deadline for Submission of Abstract
Mon, Apr 20, 2026
Notification of Abstract Acceptance
Wed, May 20, 2026
Deadline for Submission of Full Paper
Tue, Jun 30, 2026
Notification of Full Paper Acceptance

Call For Paper

Advanced Manufacturing
Emerging Technologies
Advanced Packaging
Packaging Materials & Processes
Packaging Design & Modeling
Interconnection Technologies
Quality & Reliability
Power Electronics & Energy Electronics
Optoelectronics and New Display
RF Electronic Packaging
AI-Enabled Packaging Technologies

All papers must be original and not simultaneously submitted to another journal or conference. The abstract should be approx. 500 words and contains a clear statement of the background, methodology, results, and conclusions. All accepted manuscripts will be submitted for inclusion into IEEE Xplore. Selected papers will be recommended for publication in related IEEE/EPS journals.

Committee

Organizer Contact Information

Xiaoqing WEI

Organizer

Xi'an Jiaotong University, 0086-18392959178, icept@fsemi.tech

Wen YIN

Organizer

Institute of microelectronics, Chinese Academy of Sciences, 0086-10-82995675

Yico WANG

Registration

0086-13121110782, support@fsemi.tech

Janey SHI

Sponsorship

0086-13661508648, janey@fsemi.tech