About us

The ICSICT-2026 conference is the 18th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. All aspects of solid-state devices, circuits and systems, process technologies, materials and other related research are within the scope of the conference. The program includes oral and poster sessions, panel discussions, and awards for excellent papers.

Important Dates

Thu, Jun 25, 2026
Submission deadline

Call For Paper

Circuits
Silicon photonics
Wireline integrated circuits
Digital integrated
Advanced Silicon Devices
Compound Semiconductor Devices
Advanced Process Technologies
Device Modeling & Simulation
Process Modeling & Simulation
Microwave, Millimeter Wave Devices & Circuits
Wireless System Building Blocks
ADC/DACs for Wireless Systems
Nonlinear Circuits for Wireless Systems
Integrated Passive Device & Circuits

Prospective authors are requested to submit 3 pages camera-ready full length paper in English for proceedings publication. Accepted papers will be submitted for inclusion into IEEE Xplore.

Committee

Life Honorary Chair

Yangyuan Wang

Peking University, China

General Co-Chairs

Yuehang Xu

University of Electronic Science and Technology of China, China

Wei Zhang

Fudan University, NICIC, China

Bin Zhao

IEEE EDS, USA

Francois Rivet

University of Bordeaux, France

Mengqi Zhou

IEEE Beijing Section, China

Ting-Ao Tang

Fudan University, China

Huihua Yu

Fudan University, China

Advisory Committee Co-Chairs

Chenming Hu

University of California, Berkeley, USA

Cor Claeys

Katholieke Universiteit Leuven, Belgium

K.N. Tu

University of California, Los Angeles, USA

Hiroshi Iwai

National Yang Ming Chiao Tung University, Japan