About us

EAI SmartSP 2026 is a global forum for researchers and developers from academia, industry, and government to present and discuss emerging ideas and trends in security and privacy issues in Cyber-Physical Systems and Smart Vehicles. The conference seeks original papers on theoretical analysis, vulnerability discovery, novel system architecture, and experimental studies.

Important Dates

Fri, May 8, 2026
Cycle 1 Full Paper Submission deadline
Mon, Jun 15, 2026
Cycle 1 Notification deadline
Sun, Jul 5, 2026
Cycle 1 Camera-ready deadline
Thu, Jul 16, 2026
Cycle 2 Full Paper Submission deadline
Mon, Sep 14, 2026
Cycle 2 Notification deadline
Fri, Oct 2, 2026
Cycle 2 Camera-ready deadline

Call For Paper

Accident prevention
Adaptive attack mitigation for CPS
Analytics for intelligent transportation
Authentication and access control for CPS and smart vehicles
Availability, recovery, and auditing for CPS and smart vehicles
Big data-based solutions for CPS security and privacy issues
Blockchain-based security and privacy solutions for CPS applications
Cooperative driving and traffic management
Data security and privacy for CPS and smart vehicles
Driver behavior analysis
Electric vehicle charging systems security and privacy
Embedded systems security and privacy
Efficient LLM models for vehicle applications
Intrusion detection for CPS
Legacy CPS system protection
Malware analysis for CPS and smart vehicles
Modeling and analysis of smart CPS
Security Test-bed for CPS and smart vehicles
Smart contract-based trustable and verifiable computations for CPS applications
Smart grid security and privacy
Threat modeling for CPS and smart vehicles
Traffic theory, modeling, and simulation
Urban transportation system security and privacy
V2V, V2I, and V2X: architectures and system design
Vehicle information systems
Vulnerability analysis for CPS and smart vehicles
Trustworthy AI for CPS and smart vehicles

SmartSP 2026 seeks original/invited papers focusing on theoretical analysis, vulnerability discovery, novel system architecture construction and design, emerging applications, experimental studies, and social impacts of CPS and SV. Both review/survey papers and technical papers are encouraged. SmartSP 2026 also welcomes short papers that summarize speculative breakthroughs, work-in-progress, industry-featured projects, open problems, new application challenges, visionary ideas, and preliminary studies.

Committee

Technical Program Committee Chairs

Dave Tian

Purdue University, USA

Habeeb Olufowobi

University of Texas at Arlington, USA

Organizing committee

Qiben Yan

General Chair

Michigan State University, USA

Mert D. Pesé

General Co-Chair

Clemson University, USA