About us

ICITES 2026 is the 6th International Conference on Intelligent Technology and Embedded Systems, held in Hangzhou, China. It is co-sponsored by various prestigious institutions including Hangzhou International Innovation Institute of Beihang University, IEEE Council on Electronic Design Automation, and University of Electronic Science and Technology of China, and supported by multiple universities.

Important Dates

Wed, May 20, 2026
Submission deadline

Call For Paper

Track 1: Embedded Processor and System on Chip
Track 2: Modeling and Design Automation
Track 3: Safety, Security and Reliability
Track 4: Embedded Machine Learning
Track 5: Accelerators and Heterogeneous System
Track 6: Communication and Memory Subsystem
Track 7: Embedded Operating Systems and Middleware
Track 8: Real-time and Distributed Intelligent Systems
Track 9: Embedded System for IoT & Signal Processing
Track 10: Industrial Practices and Case Studies
Special Session 1: Intelligent and embedded computing for electric power systems
Special Session 2: AI and embedded systems for computer vision and multimedia
Special Session 3: Trustworthy AI for embedded applications

The manuscript is required to have at least 6 pages with double-column format, up to 10 pages. Manuscripts must be written in English and follow the instructions at Manuscript Formatting and Templates. To ensure the high quality of the accepted papers, all submissions will be peer-reviewed. For those papers do not want to be published but want to present and discuss at the conference, you can submit an abstract first, for presentation only.

Committee

Advisory Committee

Xiaobo Sharon Hu

University of Notre Dame

Zebo Peng

Linköping University

Shiyan Hu

University of Southampton

Tsung-Yi Ho

The Chinese University of Hong Kong

Bing Guo

Sichuan University

General Chairs

Wei Jiang

University of Electronic Science and Technology of China

Zonghua Gu

Umeå University

Junlong Zhou

Nanjing University of Science and Technology

Technical Program Committee Chairs

Qi Sun

Zhejiang University

Jinyu Zhan

University of Electronic Science and Technology of China

Di Liu

Norwegian University of Science and Technology

Technical Program Committee Co-Chairs

Lin Zuo

University of Electronic Science and Technology of China

Angeliki Kritikakou

IRISA/INRIA and University of Rennes 1

Speakers

Zhiguo Shi

Zhejiang University, China, Fellow of IEEE, IET