About us

Welcome to International Conference on Electronics Packaging and Assembly Engineering (IC-EPAE-26), the premier conference for students, academicians, researchers, faculties, and industry professionals from around the world. The conference will be held on 3rd - 4th November, 2026 in Manchester, UK, and will bring together experts and thought leaders from a wide range of fields to share their insights and expertise. Our goal is to provide a platform for discussion, collaboration, and innovation. We believe that by bringing together individuals from different backgrounds and perspectives, we can create new ideas and solutions that will have a positive impact on society. Whether you're a student looking to learn from the best and brightest in your field, an academician seeking to share your research with a wider audience, or an industry professional looking to stay up-to-date with the latest trends and technologies, you'll find something to inspire and challenge you at our conference. So why wait? Register today and join us at our conference for an unforgettable experience!

Important Dates

Sun, Oct 4, 2026
Early Bird Registration
Wed, Oct 14, 2026
Paper Submission
Mon, Oct 19, 2026
Last date of Registration
Tue, Nov 3, 2026
Conference Date

Call For Paper

Advancements in electronics packaging technologies
Thermal management in electronics packaging
Reliability testing for electronic assemblies
Sustainable practices in electronics packaging
Integration of IoT in packaging systems
Challenges in electronics assembly processes
Quality control in electronics packaging
Emerging materials for electronics packaging
Design considerations for electronic assemblies
Automation in electronics manufacturing
Future trends in electronics packaging
Supply chain management for electronics assembly
Impact of 5G on electronics packaging
Electromagnetic compatibility in packaging
Case studies in electronics packaging engineering
Packaging solutions for wearable electronics
Robustness of electronic assemblies
Testing methodologies for electronics packaging
Industry standards for electronics packaging
Research directions in electronics assembly

The International Conference on Electronics Packaging and Assembly Engineering invites researchers, academicians, industry professionals, and practitioners to submit original and high-quality research contributions. This global platform is designed for knowledge exchange, innovation, and cross-domain collaboration. Focusing on key research areas such as Electrical and Electronics Engineering, the conference aims to bridge theoretical advancements with real-world applications. It encourages forward-thinking research that addresses contemporary challenges while contributing to long-term scientific and technological progress.

Committee

Conference Committee

Seyed Mojtaba Sadrameli

Professor

German University of Technology (GUtech), Oman

Dr. Taimoor Khan

Associate Professor

National Institute of Technology Silchar, India

Dr. Hewlley Imbuzeiro

Professor

Federal University of Vicosa, Brazil

Shashi Shekhar T R

Professor

East West Institute of Technology, India

Dr. Farouk Zouari

Senior Electrical Engineer

University of Tunis El, Dubai, UAE

Vamshidhar Reddy Vemula

Principal Engineer - Cloud Security

Wells Fargo, Phoenix, United States

Bishnu Pada Bose

Invosystems Solutions Pte Ltd, Singapore

K C James Raju

Professor

University of Hyderabad, India

Dr. M.P Pushpalatha

Professor

Sri Jaychamarajendra College of Engineering, JSS Science and Technology University, India

Syazwani Idrus

Universiti Putra Malaysia, Malaysia

Tickets

Conference Fee Structure
In-Person
Paper / Poster Presentation
$489$449
Paper / Poster Presentation with Scopus Publication
$769$719
Paper / Poster Presentation with Scopus Q2/Q3 Publication
$2,189$1,909
Listener
$309$279
Virtual Keynote Speaker Registration
$379$349
Pre-recorded Video Submission
$289$269
Online Presentation-
Online Presentation with Scopus Publication-
Online Presentation with Scopus Q2/Q3 Publication-
Online Listener-
Online
Paper / Poster Presentation-
Paper / Poster Presentation with Scopus Publication-
Paper / Poster Presentation with Scopus Q2/Q3 Publication-
Listener-
Virtual Keynote Speaker Registration-
Pre-recorded Video Submission-
Online Presentation
$309$279
Online Presentation with Scopus Publication
$679$629
Online Presentation with Scopus Q2/Q3 Publication
$1,969$1,689
Online Listener
$189$179

Speakers

Mr. MG Stark

Live speaking gigs outreach

Nuclear power, Renewable energy, Project Management

Prof Madya Ts. Dr. Sarifah Fauziah Syed Draman

Associate Professor

School of Chemical Engineering, Universiti Teknologi MARA Cawangan Terengganu

Anvesh Reddy Aileni

AI Solution Architecture

M.S in Computer Science, Oklahoma State University

Dr. JOSEPH WAYNE PEREZ

Chief Technology Officer

Information Technology, CogniMind (formerly SolonTek), Raleigh, NC

Mr. SAISUMAN SINGAMSETTY

DATA MANAGEMENT SPECIALIST

Enterprise Data Architecture, American Unit, San Antonio Texas

Ms. Suvianna Grecu

Co-Founder & AI Consultant

Engineering, AI, and technological research, DevCraf

Priyanka Tripathi

Associate Professor

Humanities and Social Sciences, IIT Patna

Dr. Jayashree Subramanian

Professor

Computer Science and Engineering

Dr. Deepak Sharma

HoD and IQAC Head

Research Area in Artificial Intelligence (AI), GSMCOE Pune

Prof Dr N Balasubramanian

Professor and Director, Centre for Energy Storage Technology

Chemical Engineering, Anna University, Chennai