About us

PAINE offers an exciting venue to researchers and practitioners in the field of Hardware Security and Trust who research and develop physical assurance and analysis. PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronic devices and systems safe and secure.

Important Dates

Mon, Jul 20, 2026

Full Paper (4-7 pages) submission deadline

Mon, Aug 17, 2026

Notification of Acceptance

Mon, Sep 7, 2026

Camera-ready version

Paper Submission

Research Paper Submission Tracks

New metrologies for characterization and assurance

Secure Heterogeneous Integration and Advanced Packaging

Role of LLMs in Physical Assurance and Inspection

Emerging topics in physical inspection and assurance

Test vehicles and performance quantification

Multi-modal Analysis

Automated inspection and metrology for advanced packaging

Additive manufacturing assurance for electronics

Image analysis & artificial intelligence for assurance and inspection

RadHard design and assessment

Novel material and devices for assurance

Forensic Analysis

Sample Preparation for advanced node devices

PCB trust and assurance

Chip and PCB level decomposition for assurance

Side channel assessment for assurance and countermeasures

FIB/SEM for assurance

Electro-optical probing using PEM, EOP, EOFM, etc.

Physical/side channel fingerprinting

Mod-chip on PCB

Micro probing and nanoprobing

Physical and design interface assurance

Fault injection assessment and countermeasures

Field-based weakness

Countermeasures against tampering and decomposition

Physical/logical shielding, etc.

FPGA Bitstream protection and vulnerabilities

Analog & mixed-signal circuits and systems security

Security primitives: Novel devices, materials, and systems

Trojans and backdoors: Detection and prevention

Counterfeit Detection and Anti-Counterfeit Technique

Inspection Structures for Assurance

Call for Papers Description

PAINE brings together experts from government, instrumentation, original component manufacturers (OCMs), original equipment manufacturers (OEMs), and academic researchers together to share ideas and solutions to make electronic devices and systems safe and secure.