About us

MicDAT' 2026 is an international forum highlighting the impact of modern microelectronic technologies. The conference covers technology platforms, manufacturing routes for advanced microelectronic devices, SoC/SiP solutions, heterogeneous integration, advanced packaging, and MEMS/NEMS technologies. It aims to bridge the gap between research and scalable products, featuring plenary talks, oral and poster presentations, tutorials, and exhibitions.

Important Dates

Sat, Jul 25, 2026
Abstract registration deadline
Sun, Aug 30, 2026
Submission deadline

Call For Paper

Assembly and Packaging
Hardware/software co-design
Analog, digital, mixed, and RF circuits and related design methodologies
Analog-to-Digital Converters (ADC)
Voltage-to-Frequency Converts (VFC)
Frequency-to-Digital Converters (FDC)
Time-to-Digital Converters (TDC)
Semiconductor Devices: physics and technology
Circuit Theory and Applications
Active and Passive Electronic Components
Logic, architectural, and system level synthesis
Nonlinear circuits
Microprocessors, microcontrollers and DSPs
Testing, design for testability, built-in self-test
Area, power, and thermal analysis and design
Mixed-domain simulation and design
Embedded systems, low-power designs
VLSI Circuit and Systems design
Non-von Neumann computing and related technologies and circuits
Design and test of high complexity systems integration
SoC, MPSoC, NoC, SIP, and NIP design and test
Process technologies, CMOS, BJT, BiCMOS, GaAs
3-D integration design and analysis
Emerging device technologies and circuits
Design for Manufacturability/Technology Optimization/Yield & Quality
Microelectronics processing and materials
Semiconductor processing
Modern electronics materials
Solid-state electronics
Quantum electronics
Thin solid films
Nanoprocessing, nanotechnology and nanofabrication
Nanoelectronics and Spintronics
Flexible and stretchable electronics
MEMS, MOEMS and NEMS
Computer-Aided Design (CAD) of Integrated Circuits
Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
Electronic materials science and technology
Electronics Cooling and Thermal Control
Optoelectronics
Organic electronic materials and devices
Microelectronics reliability and qualification

All papers must be original and not simultaneously submitted to another journal or conference. Categories include Regular papers, Posters, Special sessions papers, Keynote presentations, Invited talks, Industrial presentations, and Exhibition.

Committee

Program Committee

Prof., Dr. Sergey Y. Yurish

Chairman, IFSA, Spain

Prof., Dr. Freddy Gabbay

Advisory Chairman, Hebrew University of Jerusalem, Israel

Dr. Ephraim Suhir

Advisory Chairman, Bell Labs, USA

Dr. Josef Huran

Advisory Chairman, Slovak Academy of Science, Slovakia

Prof., Dr. Vijyakumar Varadarajan

Advisory Chairman, University of Technology Sydney, Australia

Mrs. Tetyana Zakharchenko

Conference and Publication Manager, IFSA Publishing, S.L., Spain