ICDMAA 2026: 20. International Conference on Dynamic Mechanical Analysis and Applications
About us
The International Research Conference is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program. Events will run over a span of time during the conference depending on the number and length of the presentations. With its high quality, it provides an exceptional value for students, academics and industry researchers.
International Conference on Dynamic Mechanical Analysis and Applications aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Dynamic Mechanical Analysis and Applications. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Dynamic Mechanical Analysis and Applications.
Important Dates
Call For Paper
International Conference on Dynamic Mechanical Analysis and Applications aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Dynamic Mechanical Analysis and Applications. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Dynamic Mechanical Analysis and Applications.
Committee
Conference Committee
Vijay Srinivas Tida
College of St. Benedict and St. John's University, United States
Narang Dixita Sohanlal
Stony Brook University, United States
Naresh Reddy Kolanu
St. Cloud State University, United States
Ali Othman
Pall Corporation, United States
Debatosh Das
University of Missouri-Columbia, United States
Keith Rozenburg
Meta Reality Lab, United States
Chung Hyun Goh
University of Texas at Tyler, United States
Emmanuel Des-Bordes
Blue Ridge College, United States
Chen Liu
Syracuse University, United States
Kuldeep Rawat
Elizabeth City State University, United States
Hatem Abou-Senna
University of Central Florida, United States
Sherif Elwakil
University of Massachusetts Dartmouth, United States
Upasna Vishnoi
Marvell Semiconductor, United States
Enqiang Lin
Virginia Polytechnic Institute and State University, United States
David Boyajian
California State University, Northridge, United States
Xiaowei Zhou
Northwestern University, United States
You Lu
Schlumberger, United States
Sabah Ansar
KSU, United States
Vera Saint Dennis
University of the Virgin Islands, United States
Venkat Krishnan
Iowa State University, United States
Gurmukh Singh
Fredonia State University, United States
Reza Masoudi Nejad
Xi'an Jiaotong University, Faculty of Human Settlements and Civil Engineering, China
Francesco Freddi
University of Parma, Italy
Valentine Kanyanta
Element Six UK Ltd, United Kingdom
Peyman Beiranvand
Razi University, Iran
Arslan Kurbanmagomedov
RUDN University, Russia
Md Shafiul Ferdous
Khulna University of Engineering and Technology, Bangladesh
Daniel Alves
UFPB- Federal University of Paraba, Brazil
V. C. Sathish Gandhi
University College of Engineering Nagercoil, India
Abu Rayhan Md Ali
Bangladesh University of Engineering and Technology (BUET), Bangladesh
| Conference Fee Structure | |
|---|---|
| Registration Type | General Registration |
| Non-Student Oral/Poster Presenter Registration | €500€450 |
| Student Oral/Poster Presenter Registration | €400€350 |
| Listener Registration | €300€250 |
| Additional Paper Publication | €100€100 |